3D Viewer

C5TTM000 | Modular system for raised flooring

Modular system for raised flooring

Manufacturer JVP sas di Marco Claudio Valerio & C.

Chipboard FSC® core panels, density between 700 and 750 kg/m3, totally encased in two steel galvanized tray, thickness between 0,30 and 0,35 mm, assembled with vinyl gluing and double folded with patented perimeter joint, bare finishing for loose-lay covering application, panels fixed by screws to the stringerless sub structure. EN128025 class 3/3.0/A/1 ; PSA MOB SPU PF2 class Euro Grade ; EN 13501.1 class Bfl.s1 ; EN13501.2 class REI30r

JVP sas di Marco Claudio Valerio & C. Catalogues

Videos

Web links

Modular system for raised flooring C5TTM000 | Modular system for raised flooring - JVP sas di Marco Claudio Valerio & C.

Modular system for raised flooring C5TTM000 | Modular system for raised flooring - JVP sas di Marco Claudio Valerio & C.
Modular system for raised flooring C5TTM000 | Modular system for raised flooring - JVP sas di Marco Claudio Valerio & C.

Modular system for raised flooring C5TTM000 | Modular system for raised flooring - JVP sas di Marco Claudio Valerio & C.
JVP 4X4 on BIM - ArchiCAD
JVP Raised access floor system - Revit
Loading Extra News
Loading event fair
Qr-code
Loading product info request form

Tags