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C4TTM000 | Modular system for raised flooring

Modular system for raised flooring

Manufacturer JVP

Chipboard FSC® core panels, density between 700 and 750 kg/m3, totally encased in two steel galvanized tray, thickness between 0,40 and 0,45 mm, assembled with vinyl gluing and double folded with patented perimeter joint, bare finishing for loose-lay covering application, panels fixed by screws to the stringerless sub structure. EN128025 class 4/3.0/A/1 ; PSA MOB SPU PF2 class Medium Grade ; EN 13501.1 class Bfl.s1 ; EN13501.2 class REI30r

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Modular system for raised flooring C4TTM000 | Modular system for raised flooring - JVP

Modular system for raised flooring C4TTM000 | Modular system for raised flooring - JVP
Modular system for raised flooring C4TTM000 | Modular system for raised flooring - JVP

Modular system for raised flooring C4TTM000 | Modular system for raised flooring - JVP
JVP 4X4 on BIM - ArchiCAD
JVP Raised access floor system - Revit
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