Share

JVP C3TTL000 | Modular system for raised flooring

Modular system for raised flooring

Get directly in touch with JVP

More on Brand

JVP

Piove di Sacco, Italy
Overview
Name of product/article

C3TTL000 | Modular system for raised flooring

Type

Modular system for raised flooring

Product code
C3TTL000

Chipboard FSC® core panels, density between 650 and 700 kg/m3, totally encased in two steel galvanized tray, thickness between 0,40 and 0,45 mm, assembled with vinyl gluing and double folded with patented perimeter joint, bare finishing for loose-lay covering application, stringerless sub structure. EN128025 class 1/3.0/A/1 ; PSA MOB SPU PF2 class Light Grade ; EN 13501.1 class Bfl.s1 ; EN13501.2 class REI30r


You might also like...
Recently Viewed