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JVPC4TTL000 | Modular system for raised flooring

Modular system for raised flooring

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JVP

Piove di Sacco, Italy
Overview
Name of product/article
C4TTL000 | Modular system for raised flooring
Type
Modular system for raised flooring

Chipboard FSC® core panels, density between 650 and 700 kg/m3, totally encased in two steel galvanized tray, thickness between 0,40 and 0,45 mm, assembled with vinyl gluing and double folded with patented perimeter joint, bare finishing for loose-lay covering application, panels fixed by screws to the stringerless sub structure. EN128025 class 2/3.0/A/1 ; PSA MOB SPU PF2 class Light Grade ; EN 13501.1 class Bfl.s1 ; EN13501.2 class REI30r

Further info from manufacturer on C4TTL000 | Modular system for raised flooring

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